Company Brief
What the company does
Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip scale packaging, as well as a range of leadframe and substrate integrated circuit packages. It also provides test services comprising wafer probe and final testing on test equipment covering test platforms, such as radio frequency, analog, digital, and mixed signal; and test …